Glenn R. Blackwell
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.
The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.
Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.
Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.
The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.
Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.
Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Fundamentals of the Design Process. Surface Mount Technology. Integrated Circuit Packages. Direct Chip Attach. Circuit Boards. EMC and PCB Design. Hybrid Assemblies. Interconnects. Design for Test. Adhesive and Its Application. Thermal Management. Testing. Inspection. Package/Enclosure. Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach. Product Safety and Third-Party Certification. Appendix A: Definitions. Index.
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. As the demand for smaller, faster, and lighter products continues, electronic packaging includes a widening range of evolving topics and technologies. The Electronic Packaging Handbook provides essential information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of electronic products. Topics addressed include design automation, new integrated circuit packaging technologies, materials, testing, and safety.
"...highly recommended...enough detail...provides essential factural information on the design, manufacturing, and testing of electronic devices and systems...this book is primarily for engineers and technicians involved in any aspect of design, production, testing, or packaging of electronic products...The book ties together well with references between chapters...well written and edited...each chapter includes a section of bibliographic references and suggested readings."
--Dave Fish, Pandion Electronics, Inc., SMTnet.com
"...highly recommended...enough detail...provides essential factural information on the design, manufacturing, and testing of electronic devices and systems...this book is primarily for engineers and technicians involved in any aspect of design, production, testing, or packaging of electronic products...The book ties together well with references between chapters...well written and edited...each chapter includes a section of bibliographic references and suggested readings."--Dave Fish, Pandion Electronics, Inc., SMTnet.com
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. This book offers an information on the design, manufacturing, and testing of electronic devices and systems. It addresses topics such as design automation, integrated circuit packaging technologies, materials, testing, and safety.
Über den Autor
Glenn R. Blackwell
Inhaltsverzeichnis
Fundamentals of the Design Process. Surface Mount Technology. Integrated Circuit Packages. Direct Chip Attach. Circuit Boards. EMC and PCB Design. Hybrid Assemblies. Interconnects. Design for Test. Adhesive and Its Application. Thermal Management. Testing. Inspection. Package/Enclosure. Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach. Product Safety and Third-Party Certification. Appendix A: Definitions. Index.
Klappentext
The packaging of electronic systems and devices represents a serious challenge for designers and managers. A major new entry in the Electrical Engineering series, The Electronic Packaging Handbook provides essential information on the design and packaging of electronic devices and systems. The book is valuable to engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products. Topics covered include design automation, new IC packaging technologies, materials, testing, and safety issues. TOC:Fundamentals of the Design Process.- Electronic Design Automation.- Design for Test.- Substrates.- Grounding and Ground Plane Techniques for Circuit Assemblies.- Part Technologies.- Connector Technologies, On and Off Board.- Optical Connections.- Thermal Issues and Management.- Surface Mount Manufacturing Technologies.- Ceramic Assemblies.- Chip On Board Assemblies.- Inspection of Assemblies.- Testing of Assemblies.- Design for Test.- Special Circuit Consideration, High Speed Digital Circuits.- Special Circuit Considerations, RF Circuits.- Special Circuit Consideration, I/O Circuits.- Special Circuit Considerations, Low-Level Analog Circuits.- Package Considerations.- Safety and Third-Party Inspection Issues.- CEE Testing.
