Autor/Autorin: Ituero Pablo
Assistant Professor at the Technical University of Madrid, holds a Ph.D. and a 5-year Engineering in Telecommunications from the same university and a MSc in Electrical Engineering with a major in System-on-a-Chip-Design from the Royal Institute of Technology of Sweden. Specialized in variability-aware VLSI design from transistor to system level.
Temperature is a first class design concern in modern integrated circuits. The important increase in power densities associated to recent technology evolutions has lead to the apparition of thermal gradients and hot spots during run time operation. Temperature impacts several circuit parameters such as speed, cooling budgets, reliability, power consumption, etc. In order to fight against these negative effects, dynamic thermal management techniques adapt the behavior of the chip relying on the information of a monitoring system that provides run-time thermal information of the die surface. This book covers the most important topics related to on-chip thermal monitoring, such as the design, placement and interconnection of temperature sensors, from a practical perspective.
Über den Autor
Assistant Professor at the Technical University of Madrid, holds a Ph.D. and a 5-year Engineering in Telecommunications from the same university and a MSc in Electrical Engineering with a major in System-on-a-Chip-Design from the Royal Institute of Technology of Sweden. Specialized in variability-aware VLSI design from transistor to system level.
Klappentext
Temperature is a first class design concern in modern integrated circuits. The important increase in power densities associated to recent technology evolutions has lead to the apparition of thermal gradients and hot spots during run time operation. Temperature impacts several circuit parameters such as speed, cooling budgets, reliability, power consumption, etc. In order to fight against these negative effects, dynamic thermal management techniques adapt the behavior of the chip relying on the information of a monitoring system that provides run-time thermal information of the die surface. This book covers the most important topics related to on-chip thermal monitoring, such as the design, placement and interconnection of temperature sensors, from a practical perspective.
