Über den Autor
Kazuo Kondo is Professor at the Department of Chemical engineering, Osaka Prefecture University. He has over 200 research publications and 100 patents. His major areas of research are copper electrodeposition for nano fabrication, electrodeposition, batteries, and CVD.
Dale Barkey is a Professor of Chemical Engineering at the University of New Hampshire where he joined the faculty in 1987. His research in Electrochemical Engineering has addressed Pattern Formation, Electrodeposition, Anodizing and Corrosion Processes. His work has appeared in The Journal of the Electrochemical Society, Physical Review, The American Concrete Institute Materials Journal and Plating and Surface Finishing.
Rohan Akolkar is an Associate Professor of Chemical Engineering at Case Western Reserve University (CWRU) in Cleveland, OH. His research focuses on fundamental electrochemistry and electrochemical engineering. His work on electrodeposition has appeared in the Journal of the Electrochemical Society and the Journal of Power Sources. In 2004, he was received the Norman Hackerman Prize by the Electrochemical Society.
Masayuki Yokoi is the Chief Technical Consultant at the Industrial Technology Support Institute of Higashioska City, Osaka Prefecture, Japan.
Preface (Kazuo Kondo)
PART 1 Copper electrodepositon and additive chemistry
Chapter 1 - Copper electrodeposition (Masayuki Yokoi)
Chapter 2 - Suppression effect and Additive Chemistry (Masayuki Yokoi)
Chapter 3- Acceleration effect (Dale P. Barkey)
Chapter 4- Modeling and Simulation ( Yutaka Kaneko)
PART 2 Copper on chip metallization
Chapter 5- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects (James R. Rohan)
Chapter 6- Microstructure of Evolution of Copper in Nano-scale Interconnect Features (James Kelly, Christopher Parks, James Demarest, and Christopher Penny)
Chapter 7- Direct Copper Plating (Aleksandar Radisic and Philippe M. Vereecken)
Part 3 - Through Silicon Via and Other Methods
Chapter 8- Through Silicon Via (Kazuo Kondo)
Chapter 9- Build-up Printed Wiring board (Kiyoshi Takagi a and Toshkazu Okubo)
Chapter 10- Copper Foil Smooth on Both Sides for Lithium Ion Battery (Akitoshi Suzuki and Jun Shinozaki)
Chapter 11- Through hole plating (Wei-Ping Dow)
Focuses on wide range of microelectronics application
Describes scientific mechanism of copper electrodeposition
Modern and basic knowledge about nanotechnology