Provides solutions to several common reliability issues in microsystem packaging
Teaches the reader methods to understand and predict failure mechanisms at interfaces between dissimilar materials
Combines thermodynamic-diffusion kinetic modelling with experimental microstructural analysis
Introduction: Away from trial and error methods.- Materials and interfaces in Microsystems.- Introduction to mechanics of materials.- Introduction to thermodynamic-kinetic method.- Interfacial adhesion in polymer systems.- Evolution of different types of interfacial structures.
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the "traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.
In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes:
-solutions to several common reliability issues in microsystem technology,
-methods to understand and predict failure mechanisms at interfaces between dissimilar materials and
-an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.
Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
This book provides solutions to several common reliability issues in microsystem packaging. It teaches the reader methods to understand and predict failure mechanisms at interfaces between dissimilar materials.
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the "traditional" method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.
In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes:
solutions to several common reliability issues in microsystem technology,
methods to understand and predict failure mechanisms at interfaces between dissimilar materials and
an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.
Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
Inhaltsverzeichnis
Introduction: Away from trial and error methods.- Materials and interfaces in Microsystems.- Introduction to mechanics of materials.- Introduction to thermodynamic-kinetic method.- Interfacial adhesion in polymer systems.- Evolution of different types of interfacial structures.
Klappentext
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the "traditional" method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.
In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes:
solutions to several common reliability issues in microsystem technology,
methods to understand and predict failure mechanisms at interfaces between dissimilar materials and
an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.
Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
Provides solutions to several common reliability issues in microsystem packaging
Teaches the reader methods to understand and predict failure mechanisms at interfaces between dissimilar materials
Combines thermodynamic-diffusion kinetic modelling with experimental microstructural analysis
Includes supplementary material: sn.pub/extras
