Über den Autor
Both Prof. Heinrich Meyr and Prof. Rainer Leupers have (co-)authored numerous books for Springer
Foreword. Preface. 1. INTRODUCTION. 1.1 Challenge: From Board to SoC. 1.2 Degrees of SoC Customization. 1.3 Organization of this Book. 2. SOC DESIGN METHODOLOGIES. 2.1 Traditional HW/SW Co-Design. 2.2 System Level Design. 2.3 Current Research on SoC Design Methodologies. 2.4 Contribution of this Work. 3. COMMUNICATION MODELING. 3.1 Transaction Level Modeling. 3.2 Generic Communication Modeling. 3.3 Communication Customization. 3.4 The BusCompiler Tool. 4. PROCESSOR MODELING. 4.1 Generic Processor Modeling. 4.2 Processor Customization Techniques. 4.3 LISA. 5. PROCESSOR SYSTEM INTEGRATION. 5.1 Simulator Structure. 5.2 Adaptors: Bridging Abstraction Gaps. 5.3 Commercial SoC Simulation Environments. 6. SUCCESSIVE TOP-DOWN REFINEMENT FLOW. 6.1 Phase 1: Standalone. 6.2 Phase 2: IA ASIP - AVF Communication Models. 6.3 Phase 3: IA ASIP - CA TLM Bus. 6.4 Phase 4: CA ASIP - CA TLM Bus. 6.5 Phase 5: BCA ASIP - CA TLM Bus. 6.6 Phase 6: RTL ASIP - CA TLM Bus. 6.7 Phase 7: RTL ASIP - RTL Bus. 7. AUTOMATIC RETARGETABILITY. 7.1 MP-SoC Simulator Generation Chain. 7.2 Structure of the Generated Simulator. 7.3 Bus Interface Specification. 8. DEBUGGING AND PROFILING. 8.1 Multiprocessor Debugger. 8.2 TLM Bus Traffic Visualization. 8.3 Bus Interface Analysis. 9. CASE STUDY. 9.1 Multi Processor JPEG Decoding Platform. 9.2 Phase 2: IA+AVF Platform. 9.3 Phase 3: IA + BusCompiler Platform. 9.4 Phase 4: CA + BusCompiler Platform. 9.5 Phase 5: BCA + BusCompiler Platform. 10. SUMMARY. Appendices. A. Businterface Definition Files. A.1 Generic AMBA 2.0 Protocol. A.2 Derived AMBA 2.0 Protocols. A.3 AMBA 2.0 Bus Interface Specification. B. Extended CoWare Tool Flow. List of Figures. References. Index.
Computerarchitecturepresentlyfacesanunprecedentedrevolution: Thestep from monolithic processors towards multi-core ICs, motivated by the ever - creasingneedforpowerandenergyef ciencyinnanoelectronics. Whetheryou prefer to call it MPSoC (multi-processor system-on-chip) or CMP (chip mul- processor), no doubt this revolution affects large domains of both computer science and electronics, and it poses many new interdisciplinary challenges. For instance, ef cient programming models and tools for MPSoC are largely an open issue: "Multi-core platforms are a reality - but where is the software support" (R. Lauwereins, IMEC). Solving it will require enormous research efforts as well as the education of a whole new breed of software engineers that bring the results from universities into industrial practice. Atthesametime,thedesignofcomplexMPSoCarchitecturesisanextremely time-consuming task, particularly in the wireless and multimedia application domains, where heterogeneous architectures are predominant. Due to the - ploding NRE and mask costs most companies are now following a platform approach: Invest a large (but one-time) design effort into a proper core - chitecture, and create easy-to-design derivatives for new standards or product features. Needless to say, only the most ef cient MPSoC platforms have a real chance to enjoy a multi-year lifetime on the highly competitive semiconductor market for embedded systems.
New methodology with potential for obtaining best results in MP-SoC design
Most detailed book about retargetable processor system integration
Separate, elaborated introduction into state of the art for all 3 involved fields