Acknowledgments. List of Acronyms and Symbols. 1. Introduction. 2. Some remarks on microsystem systematic and development. 2.1 Literature 3. Deep three-dimensional silicon micromachining. 3.1 Micromechanical substrates and mechanical properties of silicon. 3.2 Wet anisotropic etching of silicon. 3.3 Basic micromechanical constructions. 3.4 Literature 4. Bonding. 4.1 Surface cleaning and activation. 4.2 High temperature fusion bonding. 4.3 Low temperature bonding. 4.4 Anodic (electrostatic) bonding. 4.5 Literature 5. Classification of bonding and closing remarks. 5.1 Literature
This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.
The first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology
Detailed description and working receipts (know-how) of KOH etching and anodic bonding of silicon and borosilicate glass,
Several examples of microsystem fabrication procedures, process lay-outs, discussion of "technological kitchen" based on author's own laboratorial experience, rich literature data
Hundreds of pictures and photographs suitable for teaching of microsystem technology and better accommodation of the material by students
Can be read by non-specialists to understand what microsystems and their applications are