Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMS
Discusses specific MEMS fabrication techniques that fall into three primary categories: Additive, Subtractive, Lithography/patterning, as well as wafer Bonding, Doping, Surface Treatment/preparation, and Characterization Techniques
Provides the reader with a quick check list of the advantage/disadvantage of fabrication
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Introduction – Reza Ghodssi and Pinyen Lin.- The MEMS Design Process – Tina Lamers and Beth Pruitt.- Additive Processes for Semiconductors and Dielectric Materials – Chris Zorman, Robert C. Roberts and Li Chen.- Additive Processes for Metals – David Arnold, Monika Saumer and Yong Kyu-Yoon.- Additive Processes for Polymeric Materials – Ellis Meng, Xin Zhang, and William Benard.- Additive Processes for Piezoelectric Materials – Ronald Polcawich, Jeff Pulskamp, Takashi Mineta, and Yoichi Haga.- Materials and Processes in Shape-Memory Alloy - Takashi Mineta and Yoichi Haga.- Dry Etching for Micromachining Applications – Srinivas Tadigadapa and Franz Laermer.- MEMS Wet-Etch Processes and Procedures – David Burns.- MEMS Lithography and Micromachining Techniques - Daniel Hines, Nathan Siwak, Lance Mosher and Reza Ghodssi.- Doping - Alan D. Raisanen.- Wafer Bonding – Shawn Cunningham and Mario Kupnik .- MEMS Packaging Materials – Ann Garrison Darrin and Robert Osiander.- Surface Treatment and Planarization – Pinyen Lin, Roya Maboudian, Carlo Carraro, Fan-Gang Tseng, Pen-Cheng Wang, and Yongqing Lan.- MEMS Process Integration – Michael Huff, Stephen Bart, and Pinyen Lin.
MEMS Materials and Processes Handbook is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The extensive 'Material Selection Guide' and a 'Material Database' guides the reader through the selection of appropriate materials for the required task at hand. The 'Processes' section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs. The book also: Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMS Discusses specific MEMS fabrication techniques such as additive, subtractive, and lithography/patterning, as well as wafer bonding, doping, surface treatment/preparation, and characterization techniques Provides the reader with a quick check list of the advantage/disadvantage of fabrication MEMS Material and Processes Handbook will be a valuable book for researchers, engineers and students working in MEMS and materials processing.
From the reviews:
"In this handbook, editors Ghodssi (Univ. of Maryland, College Park) and Lin (Touch Micro-system Technology, Taiwan) have essentially organized the collective knowledge of decades of MEMS research from around the world into one book. ... This volume is not designed as a textbook, but instead as a reference, and is extremely useful for MEMS inventors. Summing Up: Highly recommended. Graduate students, researchers/faculty, and professionals.” (N. M. Fahrenkopf, Choice, Vol. 49 (2), October, 2011)
This comprehensive reference on materials, properties, and specific processes for MEMS fabrication includes a "Material Selection Guide" and a "Material Database". The "Processes" section catalogs microfabrication processes, with examples of common uses.
MEMS Materials and Processes Handbook is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The extensive 'Material Selection Guide' and a 'Material Database' guides the reader through the selection of appropriate materials for the required task at hand. The 'Processes' section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs. The book also:
Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMS
Discusses specific MEMS fabrication techniques such as additive, subtractive, and lithography/patterning, as well as wafer bonding, doping, surface treatment/preparation, and characterization techniques
Provides the reader with a quick check list of the advantage/disadvantage of fabrication
MEMS Material and Processes Handbook will be a valuable book for researchers, engineers and students working in MEMS and materials processing.
Introduction - Reza Ghodssi and Pinyen Lin.- The MEMS Design Process - Tina Lamers and Beth Pruitt.- Additive Processes for Semiconductors and Dielectric Materials - Chris Zorman, Robert C. Roberts and Li Chen.- Additive Processes for Metals - David Arnold, Monika Saumer and Yong Kyu-Yoon.- Additive Processes for Polymeric Materials - Ellis Meng, Xin Zhang, and William Benard.- Additive Processes for Piezoelectric Materials - Ronald Polcawich, Jeff Pulskamp, Takashi Mineta, and Yoichi Haga.- Materials and Processes in Shape-Memory Alloy - Takashi Mineta and Yoichi Haga.- Dry Etching for Micromachining Applications - Srinivas Tadigadapa and Franz Laermer.- MEMS Wet-Etch Processes and Procedures - David Burns.- MEMS Lithography and Micromachining Techniques - Daniel Hines, Nathan Siwak, Lance Mosher and Reza Ghodssi.- Doping - Alan D. Raisanen.- Wafer Bonding - Shawn Cunningham and Mario Kupnik .- MEMS Packaging Materials - Ann Garrison Darrin and Robert Osiander.- Surface Treatment and Planarization - Pinyen Lin, Roya Maboudian, Carlo Carraro, Fan-Gang Tseng, Pen-Cheng Wang, and Yongqing Lan.- MEMS Process Integration - Michael Huff, Stephen Bart, and Pinyen Lin.
From the reviews:
"In this handbook, editors Ghodssi (Univ. of Maryland, College Park) and Lin (Touch Micro-system Technology, Taiwan) have essentially organized the collective knowledge of decades of MEMS research from around the world into one book. ... This volume is not designed as a textbook, but instead as a reference, and is extremely useful for MEMS inventors. Summing Up: Highly recommended. Graduate students, researchers/faculty, and professionals." (N. M. Fahrenkopf, Choice, Vol. 49 (2), October, 2011)
Inhaltsverzeichnis
Introduction ¿ Reza Ghodssi and Pinyen Lin.- The MEMS Design Process ¿ Tina Lamers and Beth Pruitt.- Additive Processes for Semiconductors and Dielectric Materials ¿ Chris Zorman, Robert C. Roberts and Li Chen.- Additive Processes for Metals ¿ David Arnold, Monika Saumer and Yong Kyu-Yoon.- Additive Processes for Polymeric Materials ¿ Ellis Meng, Xin Zhang, and William Benard.- Additive Processes for Piezoelectric Materials ¿ Ronald Polcawich, Jeff Pulskamp, Takashi Mineta, and Yoichi Haga.- Materials and Processes in Shape-Memory Alloy - Takashi Mineta and Yoichi Haga.- Dry Etching for Micromachining Applications ¿ Srinivas Tadigadapa and Franz Laermer.- MEMS Wet-Etch Processes and Procedures ¿ David Burns.- MEMS Lithography and Micromachining Techniques - Daniel Hines, Nathan Siwak, Lance Mosher and Reza Ghodssi.- Doping - Alan D. Raisanen.- Wafer Bonding ¿ Shawn Cunningham and Mario Kupnik .- MEMS Packaging Materials ¿ Ann Garrison Darrin and Robert Osiander.- Surface Treatment and Planarization ¿ Pinyen Lin, Roya Maboudian, Carlo Carraro, Fan-Gang Tseng, Pen-Cheng Wang, and Yongqing Lan.- MEMS Process Integration ¿ Michael Huff, Stephen Bart, and Pinyen Lin.
Klappentext
MEMS Materials and Processes Handbook is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The extensive 'Material Selection Guide' and a 'Material Database' guides the reader through the selection of appropriate materials for the required task at hand. The 'Processes' section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs. The book also: Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMS Discusses specific MEMS fabrication techniques such as additive, subtractive, and lithography/patterning, as well as wafer bonding, doping, surface treatment/preparation, and characterization techniques Provides the reader with a quick check list of the advantage/disadvantage of fabrication MEMS Material and Processes Handbook will be a valuable book for researchers, engineers and students working in MEMS and materials processing.
Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMS
Discusses specific MEMS fabrication techniques that fall into three primary categories: Additive, Subtractive, Lithography/patterning, as well as wafer Bonding, Doping, Surface Treatment/preparation, and Characterization Techniques
Provides the reader with a quick check list of the advantage/disadvantage of fabrication
Includes supplementary material: sn.pub/extras
